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Morphology-enhanced properties of an interpenetrating polymer network adhesive

  • ,
  • Ryan M. Toivola
    ,
  • Natalie M. Larson
    ,
  • Brian D. Flinn
  • University of Washington
    ,
  • The Boeing Company
Research Output:
Chapter in Book/Report/Conference proceeding
Conference contribution

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Abstract

An interpenetrating polymer network (IPN) adhesive was produced from electron beam cured acrylate and thermally cured epoxy components. The acrylate component was 80% bisphenol A epoxy diacrylate and 20% trimethylolpropane triacrylate. The epoxy component was a flexible mixture of 50% diglycidyl ether of bisphenol A (DGEBA) and 50% poly(propylene glycol) diglycidyl ether cured with 2-ethyl, 4-methyl imidazole. Bulk properties of an approximately 50/50 acrylate/epoxy IPN adhesive were tested and compared to those of its individual components. Mechanical tests show that the IPN possesses a favorable combination of acrylate strength and modulus plus epoxy flexibility, and the IPN fracture toughness is more than double the value of its individual components. These improvements are attributed to the IPN morphology as revealed by scanning electron microscopy.

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Bibliographic Information

Output type

Research Output:
Chapter in Book/Report/Conference proceeding
Conference contribution

Host publication Subtitle

Advanced Materials, Applications, and Processing Technology

Original language

English

Publication milestones

  • Published - 2011

Publication status

Published - 2011

Publication series

  • Publication series name: International SAMPE Technical Conference
9781934551110

Publication IDs

  • Scopus: 80052074331

Host publication title

2011 SAMPE Spring Technical Conference and Exhibition - State of the Industry