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Flow boiling heat transfer to a dielectric coolant in a microchannel heat sink

  • Purdue University
Research Output:
Chapter in Book/Report/Conference proceeding
Conference contribution

Abstract

This paper presents an experimental study of flow boiling heat transfer in a microchannel heat sink. The dielectric fluid Fluorinert FC-77 is used as the boiling liquid after it is fully degassed. The experiments were performed at three flow rates ranging from 30 to 50 ml/min. The heat transfer coefficients, as well as the critical heat flux, were found to increase with flow rate. Wall temperature measurements at three locations (near the inlet, near the exit, and in the middle of heat sink) reveal that wall dryout first occurs near the exit of the microchannels. The ratio of heat transfer rate under critical heat flux conditions to the limiting evaporation rate was found to decrease with increasing flow rate, asymptotically approaching unity. Predictions from a number of correlations for nucleate boiling heat transfer in the literature are compared against the experimental results to identify those that provide a good match. The results of this work provide guidelines for the thermal design of microchannel heat sinks in two-phase flow.

Bibliographic Information

Output type

Research Output:
Chapter in Book/Report/Conference proceeding
Conference contribution

Host publication Subtitle

Advances in Electronic Packaging 2005

Original language

English

Article number

IPACK2005-73438

Pages from-to (Number of pages)

Pages 627-634 (8 pages)

Publication milestones

  • Published - 2005

Publication status

Published - 2005

Publication series

  • Publication series name: Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
    Volume: PART A
0791842002

Publication IDs

  • Scopus: 29644432187
  • Scopus: 32844466157

Host publication title

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems