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Modeling the Electrical Behavior of Integrated Circuit Devices in the Presence of Thermal Interactions

Activity:
Talk or presentation
Oral presentation

Activity Information

Activity type

Oral presentation

Time period

10/03/2000
Talk presented at the Bi-Weekly Seminar Series of the Washington State University (WSU) Center for Advanced
Multiphase Materials Processing (CAMMP), WSU College of Engineering and Architecture.